NEMS Holds Investor Conference, Positioned for AI-Driven Advanced Packaging Growth

NEMS (TWSE: 7730) held its investor conference on June 22, sharing updates on its operating performance, technology development, and growth strategy. As AI, high-performance computing (HPC), and advanced packaging technologies continue to advance, demand for dry plasma process solutions is expected to increase across next-generation semiconductor manufacturing.

With more than 20 years of experience in plasma process equipment, NEMS focuses on key applications including IC substrates, Fan-Out Panel-Level Packaging (FOPLP), Fan-Out Wafer-Level Packaging (FOWLP), and Glass Substrate/TGV technologies. The Company continues to expand its all-dry plasma process portfolio to support evolving industry requirements.

In the first quarter of 2026, NEMS reported revenue of NT$92.23 million, up 10.9% year-over-year. Gross margin improved to 46%, operating margin reached 12%, and EPS increased 363% to NT$0.37, reflecting continued improvement in profitability and operational performance.

NEMS is actively investing in key technologies for Hybrid Bonding, Thermal Compression Bonding (TCB), and Through Glass Via (TGV) applications. Its plasma-based oxide removal, surface activation, and precision treatment solutions are designed to support the growing demand for high-yield, high-reliability advanced packaging processes.

Looking ahead, NEMS will continue strengthening its presence in AI/HPC, Hybrid Bonding, and Glass Substrate applications. Leveraging its core plasma technology expertise, the Company is well positioned to capture future growth opportunities in advanced semiconductor manufacturing.

Investor Conference Video:
https://webpro.twse.com.tw/WebPortal/vod/101/EF72E18B1FF1-6B1A76A9-6E19-11F1-B6BE/?categoryId=101