NEMS to Present at Touch Taiwan 2026 Advanced Equipment Forum, Highlighting Plasma Interface Engineering for TGV Metallization

NEMS will be participating in the “Electronic Equipment Advanced Technology Forum” held during Touch Taiwan 2026 , where we will deliver a technical presentation focusing on the critical role of plasma interface engineering in TGV (Through Glass Via) metallization processes. The session will explore how to enhance process reliability and effectively address challenges arising from material properties and thermal mismatch.

This presentation will further examine both process mechanisms and application perspectives, highlighting the potential of plasma technologies in advanced packaging and glass substrate manufacturing, and providing stable and viable solutions for next-generation high-density integration.

📍 Date: April 9, 2026
📍 Venue: Taipei Nangang Exhibition Center (TaiNEX)
🕒 Time: 11:15–11:40
🎤 Topic: Taming the Mismatch: Plasma Interface Engineering for Reliable TGV Metallization

Due to overwhelming interest, this forum is now fully booked and registration has been closed.
On-site standby may be available depending on venue capacity.