NEMS at TPCA SHOW 2025

NEMS will participate in TPCA SHOW 2025, the world’s premier annual event for the printed circuit board industry.

📆 Exhibition Dates: October 22–24, 2025
📍 Venue: Taipei Nangang Exhibition Center, Hall 1, 4F
🏢 Booth No.: L-714

🎤 Tech x Total solution : October 22 (Wed) at 16:00, K-1407

As a leading brand in plasma process equipment, NEMS will showcase 7 major plasma technology solutions:

  • Plasma Solutions for Glass IC Substrate (Glass Core / Glass Substrate)

  • Plasma Solutions for Fan-Out Panel Level Packaging

  • Plasma ABF Thickness Reduction

  • All-Dry Plasma Desmearing and Plasma Metal Etching Solutions

  • Plasma Drilling / Plasma Solutions for Shaped Holes ABF Etching

  • Plasma Solutions for Embedded IC Substrate / 3D Packaging / Hybrid Bonding

  • Plasma Solutions for PCBA (Printed Circuit Board Assembly)

In addition, NEMS will deliver a keynote presentation at the Tech x Total Solution Forum :

“Large-Area Atmospheric Pressure Plasma Tools for Hybrid Bonding in 3D Advanced Packaging”

The presentation will highlight NEMS’s latest achievements in atmospheric plasma equipment design and large-area uniform treatment technology.

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