NEMS at SEMICON Taiwan 2025

NEMS is pleased to announce our participation in SEMICON Taiwan 2025, where we will showcase our latest plasma processing solutions designed for advanced packaging, IC substrates, and PCB manufacturing.

Our exhibition will highlight eight key technology focuses:

  1. Glass Core / Glass Substrate

  2. FOPLP / FOWLP (Fan-Out Panel-Level & Wafer-Level Packaging)

  3. Plasma Drilling

  4. All Dry Method Plasma Solutions

  5. Hybrid Bonding

  6. Wafer Reclaim

  7. Wafer Plasma Dicing / Plasma Thining / Plasma Polishing

  8. CPO Plasma Solutions (Co-Packaged Optics)

📍 Venue｜Taipei Nangang Exhibition Center, Hall 1, 4F
🗓 Date｜September 10 (Wed) – September 12 (Fri), 2025
📌 Booth No.｜L0100

We warmly welcome our partners and industry peers to visit our booth, engage with our team, and explore how NEMS plasma technologies are enabling the next generation of semiconductor manufacturing.

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