NEMS Advances to SEMICON Southeast Asia 2026

Amid the restructuring of the global semiconductor supply chain and the rapid rise of Southeast Asia, NEMS is honored to co-exhibit with Hitachi High-Tech at SEMICON Southeast Asia 2026 , strengthening regional collaboration and expanding market presence. Driven by AI, HPC, and high-speed connectivity, semiconductor manufacturing is advancing toward higher density and precision.

NEMS highlights plasma solutions for Glass Core and Glass Substrate applications, optimizing surface properties to enhance signal performance and reliability for advanced packaging. The company also presents solutions for FOPLP, FOWLP, and Hybrid Bonding, covering cleaning, activation, and pre-treatment to improve yield and process stability.

In response to ESG trends, NEMS showcases plasma drilling and all-dry solutions that significantly reduce chemical and water usage while maintaining precision, applicable to ABF substrates and advanced materials. Additional offerings include wafer reclaim, plasma dicing, thinning, polishing, and silicon photonics applications. Leveraging its expertise across semiconductor, substrate, PCB, and optoelectronics industries, NEMS will continue to expand partnerships in Southeast Asia and deliver efficient, sustainable solutions for next-generation electronics.

Exhibition Information

• Event: SEMICON Southeast Asia 2026
• Date: May 5–7, 2026
• Venue: MITEC, Kuala Lumpur, Malaysia
• Booth: 2583