NEMS to Take the Stage at IMAPS Symposium 2025!

©IMAPS

NEMS is heading to San Diego, USA, to participate in the IMAPS Symposium 2025, taking place from September 29 to October 2 — the world’s premier annual event for advanced packaging and microelectronics.

The International Microelectronics Assembly and Packaging Society (IMAPS) is one of the most influential global associations, dedicated to advancing heterogeneous integration, hybrid bonding, optoelectronics, and new materials through international collaboration and knowledge exchange. Each year, it brings together leading experts and companies from around the world.

This year, NEMS will deliver a technical presentation titled:
“Key Atmospheric Plasma Solutions Lead Reliable Hybrid Bonding.”

This presentation marks not only a showcase of our latest plasma innovations but also a milestone for NEMS — bringing Taiwan’s technological excellence to the global stage. We look forward to engaging with industry leaders in San Diego and sharing the endless possibilities of plasma technology in advanced packaging.