Product

NEMST-2002IL系列

In-line Plasma Cleaner (Strip Type)

In-line Plasma Cleaner (Strip Type)
In-line Plasma Cleaner (Strip Type)
  • In-line Plasma Cleaning Process.
  • Advanced Flow Pattern Design.
  • High-Speed Plasma Cleaning: 28~33 seconds/cycle in general, including loading, plasma treatment and unloading.
  • Low Temperature Plasma Cleaning.
  • Chamber Capability: 2~3 strips or 5~6 strips of substrates or lead-frames in one cycle. Operation Mode: Manual or Auto Mode.
  • High Automation and Operation Friendly Design.
  • It can be a standalone machine or connect with upstream and downstream tools.
  • Multiple Processing Gases (Ar, O2, H2, mixed gas, etc.) can achieve the best surface cleaning and treatment effects.
  • Physical, Chemical, or Physical/Chemical Mode Cleaning Method.
  • Extremely High Cleaning Uniformity.
  • Very Little Gas Consumption.
  • Apply to Process before Die-bonding, Wire-bonding or Molding in IC Packaging or LED Packaging Applications.
  • Suitable for Flip-Chip, PBGA, Window-BGA, Mini-BGA, Micro-BGA, QFN/MLP, TFBGA (Film-BGA), LFBGA, VBGA (EBGA), Pin BGA, QFN/MLP, TCP, PCB, COB, Cu L/F, Ag-Plating L/F, Fe L/F, MMC, SD, Micro-SD, etc.