Product
NEMST-TB2012系列
Cylindric Plasma Treatment Machine
- High-Density Plasma Source (ICP): ~ion density about 1011~1013/cm3.
- Deep Plasma Penetration: uniform plasma penetration.
- Multiple Processing Gas Selectivity.
- Low Gas Flow Rate.
- Operation Mode: manual or auto mode.
- Operator-Friendly Design.
- Plasma treatment for different kinds of shapes is available.
- Multiple Processing Gases selection capable of achieving the best surface cleaning and treatment effects.
- Physical, Chemical, or Physical/Chemical Mode Cleaning Method.
- Very High Cleaning Efficiency. Extremely High Cleaning Uniformity.
- Very Little Gas Consumption.
- Suitable for surface treatment for different kinds of powders, ball-shape products, ring-shape products, irregularly-shaped products, both electronics and non-electronics products.